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        1. 科技论文

          发布日期:2021/3/2

          1、刘强,夏建文,李绪军,孙德亮,黄明起等.面向超薄器件加工的临时键合材料解决方案[J],集成技术,2021,10(1):23-34.
          2、苏星宇, 黄明起, 刘彬灿,张国平. 新型化学镀钯工艺研究. 印制电路信息[J], 2019, 27(03):12-18.
          3、张国平,夏建文,刘强,黄明起,陈伟,孙蓉,汪正平,面向超薄柔性器件加工的激光解键合方案[J], 纺织学报. 2018,5(39),155-159.
          4、Jinhui Li;Qiang Liu;Guoping Zhang;Bin Zhao;Rong Sun;Ching-Ping Wong. Thermally Reversible and Crosslinked Polyurethane Based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-Temperature[C],Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th,746-751.
          5、Jianwen Xia,Guoping Zhang,The effect of curing process on laser releasable de-bonding temporary material for 3D packages[C],International Conference on Electronic Packaging Technology (ICEPT),2017,1533-1536
          6、Mingqi Huang,Xiantang Li,Jianwen Xia,Xiaohai Li,Wenyu Qiu,Guoping Zhang,Rong Sun,Yong Mu.A Conceivably stable non-cyanide electroless gold plating for electronic packaging application[C],International Conference on Electronic Packaging Technology (ICEPT),2017,1173-1178.
          7、Qiang Liu,Guoping Zhang,Rong Sun,S.W.Ricky Lee,C.P.Wong.Investigation the effect of silane onto fabricating polymer insulation layer by spin-coating for through silicon vias[C],International Conference on Electronic Packaging Technology (ICEPT),2017,1537-1541
          8、Qiang liu,Guoping Zhang,Rong Sun,S W Ricky Lee.influence of rubber nanoparticles on the properties of Navolac-diazonaphthoquinone based photoresist[C],International Conference on Electronic Packaging Technology (ICEPT),2015,1039-1042
          9、Libo Deng,Haoming Fang,Xingtian Shuai,Rong Sun,Preparation of reversibie thermosets and their application in temporary adhesive for thin wafer handin[C],Electronic Components and Technology Conference(ECTC),2015,1197-1201
          10、Xingtian Shuai, Rong Sun, Guoping Zhang, Libo Deng. A novel temporary adhesive for thin wafer handling[C],Electronic Packaging Technology (ICEPT), 2014, 256-261
          11、帅行天,张国平,邓立波,孙蓉,李世球,汪正平,用于薄晶圆加工的临时键合胶[J],集成技术,2014,6,102-110.
          12、Lulu Zhuang,Kun Jiang,Guoping Zhang,Jiaoning Tang,Rong Sun, S W Ricky Lee,O2 Plasma Treatment in polymer insulation process for Through silicon vias[J],International Conference on Electronic Packaging Technology(ICEPT),2014,235-238

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